Back when it still went by the name of LeTV, one of China’s most ambitious and rapidly expanding technology companies earned the title of world’s first smartphone manufacturer with a Snapdragon 820-powered model under its belt.
Of course, the decoration soon proved meaningless, as everyone from Samsung to LG, HTC, Huawei, Xiaomi and so on followed Le Max Pro’s suit, managing to steal its thunder with earlier commercial launches in the markets that count and quick global distribution efforts.
LeEco even brought to light a more compact and powerful Le Max 2 in the months since CES, packing up to 6GB RAM, but as crazy as it sounds, yet another flagship Android could go official in a matter of weeks, bidding for its very own meaningless first.
No idea if this is called LeEco Le Max 3, Le Max 2 Pro or something else entirely, but rumor has it it’ll see daylight between June 29 and July 1 at Shanghai’s Mobile World Congress, with a Snapdragon 823 processor on deck.
The 823 is technically not released yet, though we all know it’s coming to stores this late summer/early fall, probably inside the Samsung Galaxy Note 7 and LG V11, among others. As the name suggests, the SoC will be an incremental upgrade over the SD820, acting as a transition silicon before the 825 and 830 can enter the scene, with the same old 14nm fabrication process, and slightly faster CPU and GPU.
The former’s Kryo 100 cores should be clocked up to 2.6 GHz, compared to only 2.15 on the 820, while the Adreno 530 GPU is said to step things up from 624 to 720 MHz.